Üretim Kriterleri

Items Flex Rigid Rigit-Flex
Material Flex Lead-free, Halogen-Free, H-Tg, Low loss FR-4, FPC High-frequency
Layers 1-6 Layers 0-40 Lyers 2-6 Layers
Max cut lamination size 400-250mm 3*3-1200mm 480-800mm
Final board thickness 0.09mm-0.2mm 0.4-3.0mm 0.3-6.0mm
Min Drill size 0.075mm 0.2mm 0.15mm
Inner layer Line Width / Space 0.03mm 0.075mm 0.075mm
Inner layer copper thickness 1/6oz-1oz 1/2oz~3.0oz 1/6oz-1oz
Out layer copper thickness 1oz Hoz-14oz 1oz
Copper to drill distance 0.2mm 0.2mm 0.2mm
Out layer line width/space 0.075mm 0.075mm 0.075mm
Max half-filled Solder Mask Plug Hole Diameter 0.05mm 0.05mm
Min non-filled Hole Diameter 0.075mm 0.2mm 0.15mm
Min solder Mask Dam 0.1mm 0.1mm 0.1mm
Sold Mask Gap 0.15mm 0.15mm 0.15mm
Min Legend Width 0.1mm 0.1mm 0.1mm
Legend thickness 10um 10um 10um
Surface Treatment OSP, ENIG, Gold Finger, Plating Gold, ENEPIG, IMM TIN, IMM AG OSP, HASL, ENIG, Gold Finger, Plating Gold, ENEPIG, IMM TIN, IMM AG 1ozOSP, HASL, ENIG, Gold Finger, Plating Gold, ENEPIG, IMM TIN, IMM AG
Warp & Twist 0.5% 0.5%

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