Items | Flex | Rigid | Rigit-Flex |
Material | Flex | Lead-free, Halogen-Free, H-Tg, Low loss | FR-4, FPC High-frequency |
Layers | 1-6 Layers | 0-40 Lyers | 2-6 Layers |
Max cut lamination size | 400-250mm | 3*3-1200mm | 480-800mm |
Final board thickness | 0.09mm-0.2mm | 0.4-3.0mm | 0.3-6.0mm |
Min Drill size | 0.075mm | 0.2mm | 0.15mm |
Inner layer Line Width / Space | 0.03mm | 0.075mm | 0.075mm |
Inner layer copper thickness | 1/6oz-1oz | 1/2oz~3.0oz | 1/6oz-1oz |
Out layer copper thickness | 1oz | Hoz-14oz | 1oz |
Copper to drill distance | 0.2mm | 0.2mm | 0.2mm |
Out layer line width/space | 0.075mm | 0.075mm | 0.075mm |
Max half-filled Solder Mask Plug Hole Diameter | – | 0.05mm | 0.05mm |
Min non-filled Hole Diameter | 0.075mm | 0.2mm | 0.15mm |
Min solder Mask Dam | 0.1mm | 0.1mm | 0.1mm |
Sold Mask Gap | 0.15mm | 0.15mm | 0.15mm |
Min Legend Width | 0.1mm | 0.1mm | 0.1mm |
Legend thickness | 10um | 10um | 10um |
Surface Treatment | OSP, ENIG, Gold Finger, Plating Gold, ENEPIG, IMM TIN, IMM AG | OSP, HASL, ENIG, Gold Finger, Plating Gold, ENEPIG, IMM TIN, IMM AG | 1ozOSP, HASL, ENIG, Gold Finger, Plating Gold, ENEPIG, IMM TIN, IMM AG |
Warp & Twist | – | 0.5% | 0.5% |